Lucas Nascimento (Electrical Engineering)

In 2012, Bios

About DOE Fellow
Lucas Nascimento received a Bachelor of Science in electrical engineering with concentrations in both integrated nano-technology and communication systems at Florida International University in the Fall of 2013. Previously, he has worked as a mathematics and physics tutor at FIU’s Housing and Residential Life Academic Resource Center, moving his way up to the supervisory position there as Sr. Tutor. He has also worked as an engineering tutor at FIU’s Office of Student Access and Success at the Engineering Campus. After completion of his bachelor’s degree, he plans to immediately continue with his studies pursuing a Master’s of Science in electrical engineering. His interests include wireless communications, antenna optimization, communications systems, nanoelectronic devices, and magneto-electric nanoparticles and their applications. He is a member of the Society of Hispanic Professional Engineers (SHPE), Institute of Electrical and Electronics Engineers (IEEE), IEEE Power and Energy Society (IEEE PES), and IEEE Computer Society (IEEE CS). Lucas is now working at Northrop Grumman Corporation as a circuit design engineer.

DOE Related Projects
As a U.S. Department of Energy Fellow, Lucas is under the mentorship of Jose Varona and is currently assigned to Project 4 Task 2 which is: D&D Support to DOE EM for Technology Innovation, Development, Evaluation and Deployment. More specifically, Lucas is working on developing a LabVIEW VI to model an electrical resistivity tomography (ERT) for superior data acquisition. The ERT uses a thermocouple system to test and attain results of properties of materials surrounding the thermocouple which is applied to determine the solid concentration of a mixture of hazardous waste in high level waste tanks. Setting the thermocouples systematically allows for a more accurate array of results which will be compiled in the improved VI. This model will enable a shared-variable network that can be used to pool data from the thermocouple systems into one location for post-processing. This VI will also eliminate the need for one of the computing units, thereby reducing power consumption.